What is the difference between HDI 江南体育网(中国)有限公司官网 and ordinary 江南体育网(中国)有限公司官网?

What is the difference between HDI 江南体育网(中国)有限公司官网 and ordinary 江南体育网(中国)有限公司官网?
Introduction HDI 江南体育网(中国)有限公司官网
High Density Interconnector 江南体育网(中国)有限公司官网 (HDI 江南体育网(中国)有限公司官网), known as high-density interconnection board, is a high-density circuit board with high line distribution density MICro blind hole technology is adopted HDI 江南体育网(中国)有限公司官网 has internal and external lines, and then each layer of pipeline is internally connected through drilling, in hole metallization and other processes
HDI 江南体育网(中国)有限公司官网 is generally made of stacked pipes. The more stacking times, the higher the technology level of the board. Ordinary HDI 江南体育网(中国)有限公司官网 is basically one layer. High precision HDI 江南体育网(中国)有限公司官网 adopts two or more stacking processes and advanced 江南体育网(中国)有限公司官网 technology, such as stacking holes, electroplating filLED holes, laser direct drilling, etc.
The above is the explanation given by the editor of 江南体育网(中国)有限公司官网 circuit board company. If you want to know more about 江南体育网(中国)有限公司官网A, you can go to our company's home page to learn about it. In addition, our company also sells various circuit boards,
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When the 江南体育网(中国)有限公司官网 density is increased by more than 8 layers, the cost of HDI will be lower than that of the traditional complex compaction process HDI 江南体育网(中国)有限公司官网 is conducive to the application of advanced construction technology. Its power efficiency and signal correctness are higher than those of traditional 江南体育网(中国)有限公司官网, and HDI board has better radio frequency interference, electromagnetic wave interference, electrostatic discharge device, thermal conductivity and other aspects
HDI 江南体育网(中国)有限公司官网
HDI 江南体育网(中国)有限公司官网
Electronic products continue to develop towards high-density and high-precision The so-called "high" not only improves the efficiency of the machine, but also reduces the size of the machine High density integration (HDI 江南体育网(中国)有限公司官网) technology can make the final product design SMAller to meet higher electronic efficiency and efficiency standards At present, many popular electronic products, such as mobile phones, digital CAMeras, notebook computers, all used automotive power products HDI boards With the upgrading of electronic products and MARKet demand, HDI boards will develop rapidly
Introduction to 江南体育网(中国)有限公司官网
Printed circuit board (江南体育网(中国)有限公司官网) is an important electronic component, which is the support of electronIC components and the carrier of electrical connection of electronic components.
The main function of the device is to avoid the error of manual wiring due to the consistency of the same printed circuit board after the electronic equipment adopts the printed circuit board. It realizes automatic insertion or installation, automatic welding and automatic detection of electronic components, ensures the quality of electronic equipment, improves labor productivity, reduces costs and facilitates maintenance.
Is a 江南体育网(中国)有限公司官网 with a blind hole called an HDI 江南体育网(中国)有限公司官网?
HDI 江南体育网(中国)有限公司官网 is a high-density interconnection circuit board. The secondary platen for blind hole electroplating is HDI 江南体育网(中国)有限公司官网, which can be divided into first, second, third, fourth and fifth HDI. For example, the iPhone 6 motherboard is a fifth order HDI.

A SIMple burial hole is not necessarily a quota for human development.
How to distinguish the first, second and third order HDI 江南体育网(中国)有限公司官网.
The first order is relatively simple, and the process and process are easy to control.
The second step starts to cause problems, one is alignment, the other is drilling and copper plating. There are many second-order designs. One is that each order is wrong. When connecting the second adjacent layer, you need to connect the conductors of the middle layer, which is equivalent to two main HDIs.
Second, two first order holes overlap and second order holes overlap. Processing is similar to the first order, but there are many key points that need special control, that is, the above points.
Third, punching directly from the outer layer to the third layer (or n-2 layer). This process is very different from the previous process, and it is more difficult to drill holes.
For the third order, the second analogy is.
Differences between HDI 江南体育网(中国)有限公司官网 and common 江南体育网(中国)有限公司官网
The common 江南体育网(中国)有限公司官网 board is mainly made of epoxy resin and electronic grade glass cloth FR-4 Generally speaking, traditional HDI should use copper foil with adhesive backing Since the glass cloth cannot be opened by laser punching, non glass fiber backed copper foil is generally used, but now the high-energy laser punching machine can break through 1180 pieces of glass cloth In this way, it is no different from ordinary data